Due 30 Apr 2027
Full scholarship for Malaysian SPM leavers to pursue A-Levels then an engineering or technology undergraduate degree locally or overseas. Includes internship at Sapura Group.
- Funding
- Full
- Deadline
- 30 Apr 2027
- Study levels
- Undergraduate
- Fields
- STEM
- Study in
- 🇲🇾 Malaysia, 🇬🇧 United Kingdom, 🇦🇺 Australia
- Open to
- 1 countries
Requirements (approximate)
- ✓Malaysian citizen with minimum 7As in SPM
- ✓Interested in engineering or technology fields
- ✓Demonstrate strong leadership and English proficiency
- ✓Not receiving any other scholarship
These are indicative. Confirm exact requirements (grades, English test scores, age, documents) on the official site before applying.
How to apply
- 1Check you meet the eligibility (nationality, academic results, language test).
- 2Prepare core documents: passport, transcripts, IELTS/TOEFL, reference letters.
- 3Get admission or a conditional offer from an eligible university if required.
- 4Submit your application on the official portal before the deadline.
Last verified 5 Jun 2026. Source. Always confirm details on the official website before applying.